Tohoku University Technology: Measurement Method for Physical Properties of Soft Thin Films: T06-028
Using ultrasound to measure the density of a polymer film with a thickness of several micrometers.
The present invention is a method for accurately measuring the physical properties of a single soft thin film, such as a thin polymer film with a thickness of several micrometers, by analyzing the amplitude spectrum of ultrasonic echoes and utilizing the acoustic resonance phenomenon that occurs when ultrasonic waves pass through the soft thin film. While conventional methods have allowed for the measurement of the physical properties of thin films tightly adhered to a substrate, it has been difficult to measure a standalone thin film. In this measurement method, the thin film is held by a specially structured jig and evacuated to adhere the thin film to the substrate, completely removing the air layer that would interfere during ultrasonic measurement, thus enabling the measurement of physical properties such as acoustic impedance and density.
- Company：Tohoku Techno Arch Co., Ltd.
- Price：Other
